<?xml version="1.0" encoding="utf-8"?>
<!DOCTYPE eagle SYSTEM "eagle.dtd">
<eagle version="9.3.1">
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<schematic xreflabel="%F%N/%S.%C%R" xrefpart="/%S.%C%R">
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<library name="PiezoFFC" urn="urn:adsk.eagle:library:6897166">
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<package name="HDRVR5W64P254_1X5_1270X254X575B" urn="urn:adsk.eagle:footprint:5071762/2" library_version="75">
<description>Single-row, 5-pin Receptacle Header (Female) Straight, 2.54 mm (0.10 in) col pitch, 5.75 mm insulator length, 12.70 X 2.54 X 5.75 mm body
&lt;p&gt;Single-row (1X5), 5-pin Receptacle Header (Female) Straight package with 2.54 mm (0.10 in) col pitch, 0.64 mm lead width, 3.00 mm tail length and 5.75 mm insulator length with overall size 12.70 X 2.54 X 5.75 mm, pin pattern - clockwise from top left&lt;/p&gt;</description>
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<description>Single-row, 5-pin Receptacle Header (Female) Straight, 2.54 mm (0.10 in) col pitch, 5.75 mm insulator length, 12.70 X 2.54 X 5.75 mm body
&lt;p&gt;Single-row (1X5), 5-pin Receptacle Header (Female) Straight package with 2.54 mm (0.10 in) col pitch, 0.64 mm lead width, 3.00 mm tail length and 5.75 mm insulator length with overall size 12.70 X 2.54 X 5.75 mm, pin pattern - clockwise from top left&lt;/p&gt;</description>
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<pin name="P$3" x="-7.62" y="-1.27" visible="pad" length="middle"/>
<pin name="P$4" x="-7.62" y="-3.81" visible="pad" length="middle"/>
<pin name="P$5" x="-7.62" y="-6.35" visible="pad" length="middle"/>
<text x="-7.62" y="6.35" size="1.27" layer="95" ratio="10">&gt;name</text>
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<device name="JST_2.54MM_5P_F" package="HDRVR5W64P254_1X5_1270X254X575B">
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<connect gate="G$1" pin="P$1" pad="1"/>
<connect gate="G$1" pin="P$2" pad="2"/>
<connect gate="G$1" pin="P$3" pad="3"/>
<connect gate="G$1" pin="P$4" pad="4"/>
<connect gate="G$1" pin="P$5" pad="5"/>
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<library name="ESP32-Platform" urn="urn:adsk.eagle:library:5224417">
<description>Generated from &lt;b&gt;ESP32-Platform.sch&lt;/b&gt;&lt;p&gt;
by exp-lbrs.ulp</description>
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<package name="SEEED-RESISTOR_R0603" urn="urn:adsk.eagle:footprint:5224469/2" library_version="31">
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<text x="-0.762" y="0" size="0.6096" layer="25" font="vector" ratio="11" rot="R90" align="bottom-center">&gt;NAME</text>
<text x="0.8" y="0.046" size="0.6096" layer="27" font="vector" ratio="11" rot="R90" align="top-center">&gt;VALUE</text>
</package>
<package name="CAPC2012X130" urn="urn:adsk.eagle:footprint:5225118/2" library_version="31">
<description>Chip, 2.00 X 1.25 X 1.30 mm body
&lt;p&gt;Chip package with body size 2.00 X 1.25 X 1.30 mm&lt;/p&gt;</description>
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<text x="0" y="0.9949" size="0.4064" layer="25" font="vector" align="bottom-center">&gt;NAME</text>
<text x="0" y="-0.9949" size="0.4064" layer="27" font="vector" align="top-center">&gt;VALUE</text>
</package>
<package name="C0603K" urn="urn:adsk.eagle:footprint:5710320/1" library_version="31">
<description>&lt;b&gt;Ceramic Chip Capacitor KEMET 0603 reflow solder&lt;/b&gt;&lt;p&gt;
Metric Code Size 1608</description>
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<text x="-0.038" y="0.65" size="0.6096" layer="25" font="vector" align="bottom-center">&gt;NAME</text>
<text x="-0.038" y="-0.634" size="0.6096" layer="27" font="vector" align="top-center">&gt;VALUE</text>
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</package>
<package name="CAPC1609X80" urn="urn:adsk.eagle:footprint:5248667/3" library_version="31">
<description>Chip, 1.60 X 0.90 X 0.80 mm body
&lt;p&gt;Chip package with body size 1.60 X 0.90 X 0.80 mm&lt;/p&gt;</description>
<wire x1="0.8" y1="-0.45" x2="-0.8" y2="-0.45" width="0.12" layer="51"/>
<wire x1="-0.8" y1="-0.45" x2="-0.8" y2="0.45" width="0.12" layer="51"/>
<wire x1="-0.8" y1="0.45" x2="0.8" y2="0.45" width="0.12" layer="51"/>
<wire x1="0.8" y1="0.45" x2="0.8" y2="-0.45" width="0.12" layer="51"/>
<smd name="1" x="-0.7" y="0" dx="0.7118" dy="1.0118" layer="1"/>
<smd name="2" x="0.7" y="0" dx="0.7118" dy="1.0118" layer="1"/>
<text x="0" y="0.6929" size="0.6096" layer="25" font="vector" align="bottom-center">&gt;NAME</text>
<text x="0" y="-0.6929" size="0.6096" layer="27" font="vector" align="top-center">&gt;VALUE</text>
</package>
<package name="CAPC1005X50" urn="urn:adsk.eagle:footprint:5248673/4" library_version="31">
<description>Chip, 1.00 X 0.55 X 0.50 mm body
&lt;p&gt;Chip package with body size 1.00 X 0.55 X 0.50 mm&lt;/p&gt;</description>
<wire x1="0.5" y1="-0.275" x2="-0.5" y2="-0.275" width="0.12" layer="51"/>
<wire x1="-0.5" y1="-0.275" x2="-0.5" y2="0.275" width="0.12" layer="51"/>
<wire x1="-0.5" y1="0.275" x2="0.5" y2="0.275" width="0.12" layer="51"/>
<wire x1="0.5" y1="0.275" x2="0.5" y2="-0.275" width="0.12" layer="51"/>
<smd name="1" x="-0.5" y="0" dx="0.5118" dy="0.6618" layer="1"/>
<smd name="2" x="0.5" y="0" dx="0.5118" dy="0.6618" layer="1"/>
<text x="0" y="0.5179" size="0.4064" layer="25" font="vector" align="bottom-center">&gt;NAME</text>
<text x="0" y="-0.5179" size="0.4064" layer="27" font="vector" align="top-center">&gt;VALUE</text>
</package>
</packages>
<packages3d>
<package3d name="SEEED-RESISTOR_R0603" urn="urn:adsk.eagle:package:5224535/3" type="model" library_version="31">
<packageinstances>
<packageinstance name="SEEED-RESISTOR_R0603"/>
</packageinstances>
</package3d>
<package3d name="CAPC2012X130" urn="urn:adsk.eagle:package:5225034/2" type="model" library_version="31">
<description>Chip, 2.00 X 1.25 X 1.30 mm body
&lt;p&gt;Chip package with body size 2.00 X 1.25 X 1.30 mm&lt;/p&gt;</description>
<packageinstances>
<packageinstance name="CAPC2012X130"/>
</packageinstances>
</package3d>
<package3d name="C0603K" urn="urn:adsk.eagle:package:5710321/1" type="model" library_version="31">
<description>&lt;b&gt;Ceramic Chip Capacitor KEMET 0603 reflow solder&lt;/b&gt;&lt;p&gt;
Metric Code Size 1608</description>
<packageinstances>
<packageinstance name="C0603K"/>
</packageinstances>
</package3d>
<package3d name="CAPC1609X80" urn="urn:adsk.eagle:package:5248663/3" type="model" library_version="31">
<description>Chip, 1.60 X 0.90 X 0.80 mm body
&lt;p&gt;Chip package with body size 1.60 X 0.90 X 0.80 mm&lt;/p&gt;</description>
<packageinstances>
<packageinstance name="CAPC1609X80"/>
</packageinstances>
</package3d>
<package3d name="CAPC1005X50" urn="urn:adsk.eagle:package:5248669/4" type="model" library_version="31">
<description>Chip, 1.00 X 0.55 X 0.50 mm body
&lt;p&gt;Chip package with body size 1.00 X 0.55 X 0.50 mm&lt;/p&gt;</description>
<packageinstances>
<packageinstance name="CAPC1005X50"/>
</packageinstances>
</package3d>
</packages3d>
<symbols>
<symbol name="SUPPLY1_VCC" urn="urn:adsk.eagle:symbol:5224419/1" library_version="31">
<wire x1="1.27" y1="-1.905" x2="0" y2="0" width="0.254" layer="94"/>
<wire x1="0" y1="0" x2="-1.27" y2="-1.905" width="0.254" layer="94"/>
<pin name="VCC" x="0" y="-2.54" visible="off" length="short" direction="sup" rot="R90"/>
<text x="-2.54" y="-2.54" size="1.778" layer="96" rot="R90">&gt;VALUE</text>
</symbol>
<symbol name="SEEED-RESISTOR_RES" urn="urn:adsk.eagle:symbol:5224429/1" library_version="31">
<wire x1="-1.27" y1="0.508" x2="1.27" y2="0.508" width="0.254" layer="94"/>
<wire x1="1.27" y1="0.508" x2="1.27" y2="-0.508" width="0.254" layer="94"/>
<wire x1="1.27" y1="-0.508" x2="-1.27" y2="-0.508" width="0.254" layer="94"/>
<wire x1="-1.27" y1="-0.508" x2="-1.27" y2="0.508" width="0.254" layer="94"/>
<pin name="1" x="-3.81" y="0" visible="off" length="short" direction="pas" swaplevel="1"/>
<pin name="2" x="3.81" y="0" visible="off" length="short" direction="pas" swaplevel="1" rot="R180"/>
<text x="-3.81" y="1.27" size="1.27" layer="95" ratio="10">&gt;NAME</text>
<text x="-3.81" y="-2.54" size="1.27" layer="96" ratio="10">&gt;VALUE</text>
</symbol>
<symbol name="SEEED-CAPACITOR_C" urn="urn:adsk.eagle:symbol:5224435/1" library_version="31">
<wire x1="-0.635" y1="-1.016" x2="-0.635" y2="0" width="0.254" layer="94"/>
<wire x1="-0.635" y1="0" x2="-0.635" y2="1.016" width="0.254" layer="94"/>
<wire x1="0.635" y1="1.016" x2="0.635" y2="0" width="0.254" layer="94"/>
<wire x1="0.635" y1="0" x2="0.635" y2="-1.016" width="0.254" layer="94"/>
<wire x1="-1.27" y1="0" x2="-0.635" y2="0" width="0.1524" layer="94"/>
<wire x1="0.635" y1="0" x2="1.27" y2="0" width="0.1524" layer="94"/>
<pin name="1" x="-3.81" y="0" visible="off" length="short" direction="pas" swaplevel="1"/>
<pin name="2" x="3.81" y="0" visible="off" length="short" direction="pas" swaplevel="1" rot="R180"/>
<text x="-3.81" y="1.27" size="1.27" layer="95" ratio="10">&gt;NAME</text>
<text x="-3.81" y="-2.54" size="1.27" layer="96" ratio="10">&gt;VALUE</text>
</symbol>
</symbols>
<devicesets>
<deviceset name="SUPPLY1_VCC" urn="urn:adsk.eagle:component:5224634/1" prefix="P+" library_version="31">
<description>&lt;b&gt;SUPPLY SYMBOL&lt;/b&gt;</description>
<gates>
<gate name="VCC" symbol="SUPPLY1_VCC" x="0" y="0"/>
</gates>
<devices>
<device name="">
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="SEEED-RESISTOR_SMD-RES-1.5K-1%-1/10W(0603)" urn="urn:adsk.eagle:component:5224608/4" prefix="R" uservalue="yes" library_version="31">
<description>301010189</description>
<gates>
<gate name="G$1" symbol="SEEED-RESISTOR_RES" x="0" y="0"/>
</gates>
<devices>
<device name="DETAILED_MODEL" package="SEEED-RESISTOR_R0603">
<connects>
<connect gate="G$1" pin="1" pad="1"/>
<connect gate="G$1" pin="2" pad="2"/>
</connects>
<package3dinstances>
<package3dinstance package3d_urn="urn:adsk.eagle:package:5224535/3"/>
</package3dinstances>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
<deviceset name="SEEED-CAPACITOR_CERAMIC-10UF-25V-10%-X5R(0805)" urn="urn:adsk.eagle:component:5224616/5" prefix="C" uservalue="yes" library_version="31">
<description>302010178</description>
<gates>
<gate name="G$1" symbol="SEEED-CAPACITOR_C" x="0" y="0"/>
</gates>
<devices>
<device name="CAP_0805-3D" package="CAPC2012X130">
<connects>
<connect gate="G$1" pin="1" pad="1"/>
<connect gate="G$1" pin="2" pad="2"/>
</connects>
<package3dinstances>
<package3dinstance package3d_urn="urn:adsk.eagle:package:5225034/2"/>
</package3dinstances>
<technologies>
<technology name=""/>
</technologies>
</device>
<device name="CAP_0603-IMP" package="C0603K">
<connects>
<connect gate="G$1" pin="1" pad="1"/>
<connect gate="G$1" pin="2" pad="2"/>
</connects>
<package3dinstances>
<package3dinstance package3d_urn="urn:adsk.eagle:package:5710321/1"/>
</package3dinstances>
<technologies>
<technology name=""/>
</technologies>
</device>
<device name="CAP_0603_GEN" package="CAPC1609X80">
<connects>
<connect gate="G$1" pin="1" pad="1"/>
<connect gate="G$1" pin="2" pad="2"/>
</connects>
<package3dinstances>
<package3dinstance package3d_urn="urn:adsk.eagle:package:5248663/3"/>
</package3dinstances>
<technologies>
<technology name=""/>
</technologies>
</device>
<device name="CAP_0402-GEN" package="CAPC1005X50">
<connects>
<connect gate="G$1" pin="1" pad="1"/>
<connect gate="G$1" pin="2" pad="2"/>
</connects>
<package3dinstances>
<package3dinstance package3d_urn="urn:adsk.eagle:package:5248669/4"/>
</package3dinstances>
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
</devicesets>
</library>
<library name="supply1" urn="urn:adsk.eagle:library:371">
<description>&lt;b&gt;Supply Symbols&lt;/b&gt;&lt;p&gt;
 GND, VCC, 0V, +5V, -5V, etc.&lt;p&gt;
 Please keep in mind, that these devices are necessary for the
 automatic wiring of the supply signals.&lt;p&gt;
 The pin name defined in the symbol is identical to the net which is to be wired automatically.&lt;p&gt;
 In this library the device names are the same as the pin names of the symbols, therefore the correct signal names appear next to the supply symbols in the schematic.&lt;p&gt;
 &lt;author&gt;Created by librarian@cadsoft.de&lt;/author&gt;</description>
<packages>
</packages>
<symbols>
<symbol name="GND" urn="urn:adsk.eagle:symbol:26925/1" library_version="1">
<wire x1="-1.905" y1="0" x2="1.905" y2="0" width="0.254" layer="94"/>
<text x="-2.54" y="-2.54" size="1.778" layer="96">&gt;VALUE</text>
<pin name="GND" x="0" y="2.54" visible="off" length="short" direction="sup" rot="R270"/>
</symbol>
</symbols>
<devicesets>
<deviceset name="GND" urn="urn:adsk.eagle:component:26954/1" prefix="GND" library_version="1">
<description>&lt;b&gt;SUPPLY SYMBOL&lt;/b&gt;</description>
<gates>
<gate name="1" symbol="GND" x="0" y="0"/>
</gates>
<devices>
<device name="">
<technologies>
<technology name=""/>
</technologies>
</device>
</devices>
</deviceset>
</devicesets>
</library>
</libraries>
<attributes>
</attributes>
<variantdefs>
</variantdefs>
<classes>
<class number="0" name="default" width="0" drill="0">
</class>
</classes>
<parts>
<part name="USB-UART" library="PiezoFFC" library_urn="urn:adsk.eagle:library:6897166" deviceset="JST-2.54MM_5P-2.54" device="JST_2.54MM_5P_F" package3d_urn="urn:adsk.eagle:package:5071743/2"/>
<part name="P+1" library="ESP32-Platform" library_urn="urn:adsk.eagle:library:5224417" deviceset="SUPPLY1_VCC" device=""/>
<part name="GND1" library="supply1" library_urn="urn:adsk.eagle:library:371" deviceset="GND" device=""/>
<part name="PYR0-PIEZO" library="PiezoFFC" library_urn="urn:adsk.eagle:library:6897166" deviceset="JST-2.54MM_5P-2.54" device="JST_2.54MM_5P_F" package3d_urn="urn:adsk.eagle:package:5071743/2"/>
<part name="R1" library="ESP32-Platform" library_urn="urn:adsk.eagle:library:5224417" deviceset="SEEED-RESISTOR_SMD-RES-1.5K-1%-1/10W(0603)" device="DETAILED_MODEL" package3d_urn="urn:adsk.eagle:package:5224535/3" value="10K"/>
<part name="C1" library="ESP32-Platform" library_urn="urn:adsk.eagle:library:5224417" deviceset="SEEED-CAPACITOR_CERAMIC-10UF-25V-10%-X5R(0805)" device="CAP_0603_GEN" package3d_urn="urn:adsk.eagle:package:5248663/3" value="100pF - 0.1uF"/>
</parts>
<sheets>
<sheet>
<plain>
</plain>
<instances>
<instance part="USB-UART" gate="G$1" x="2.54" y="5.08" smashed="yes" rot="R180">
<attribute name="NAME" x="1.27" y="13.97" size="1.778" layer="95" ratio="10"/>
</instance>
<instance part="P+1" gate="VCC" x="27.94" y="20.32" smashed="yes"/>
<instance part="GND1" gate="1" x="27.94" y="-8.89" smashed="yes">
<attribute name="VALUE" x="25.4" y="-11.43" size="1.778" layer="96"/>
</instance>
<instance part="PYR0-PIEZO" gate="G$1" x="66.04" y="7.62" smashed="yes">
<attribute name="NAME" x="58.42" y="13.97" size="1.27" layer="95" ratio="10"/>
</instance>
<instance part="R1" gate="G$1" x="30.48" y="6.35" smashed="yes" rot="R90">
<attribute name="NAME" x="29.718" y="8.382" size="1.27" layer="95" ratio="10" rot="R90"/>
<attribute name="VALUE" x="31.242" y="11.176" size="1.27" layer="96" ratio="10" rot="R270"/>
</instance>
<instance part="C1" gate="G$1" x="38.1" y="1.27" smashed="yes" rot="R180">
<attribute name="NAME" x="39.116" y="-0.508" size="1.27" layer="95" ratio="10" rot="R180"/>
<attribute name="VALUE" x="32.766" y="2.794" size="1.27" layer="96" ratio="10"/>
</instance>
</instances>
<busses>
</busses>
<nets>
<net name="GND" class="0">
<segment>
<pinref part="USB-UART" gate="G$1" pin="P$4"/>
<wire x1="10.16" y1="8.89" x2="27.94" y2="8.89" width="0.1524" layer="91"/>
<label x="10.16" y="8.89" size="1.778" layer="95"/>
<wire x1="27.94" y1="8.89" x2="27.94" y2="-6.35" width="0.1524" layer="91"/>
<pinref part="GND1" gate="1" pin="GND"/>
<pinref part="PYR0-PIEZO" gate="G$1" pin="P$2"/>
<wire x1="58.42" y1="8.89" x2="27.94" y2="8.89" width="0.1524" layer="91"/>
<junction x="27.94" y="8.89"/>
<label x="53.34" y="8.89" size="1.778" layer="95"/>
</segment>
</net>
<net name="TXD" class="0">
<segment>
<pinref part="USB-UART" gate="G$1" pin="P$3"/>
<label x="10.16" y="6.35" size="1.778" layer="95"/>
<pinref part="PYR0-PIEZO" gate="G$1" pin="P$3"/>
<wire x1="58.42" y1="6.35" x2="10.16" y2="6.35" width="0.1524" layer="91"/>
<label x="53.34" y="3.81" size="1.778" layer="95"/>
</segment>
</net>
<net name="RXD" class="0">
<segment>
<pinref part="USB-UART" gate="G$1" pin="P$2"/>
<label x="10.16" y="3.81" size="1.778" layer="95"/>
<pinref part="PYR0-PIEZO" gate="G$1" pin="P$4"/>
<wire x1="58.42" y1="3.81" x2="10.16" y2="3.81" width="0.1524" layer="91"/>
<label x="53.34" y="6.35" size="1.778" layer="95"/>
</segment>
</net>
<net name="DTR" class="0">
<segment>
<pinref part="USB-UART" gate="G$1" pin="P$1"/>
<label x="10.16" y="1.27" size="1.778" layer="95"/>
<pinref part="C1" gate="G$1" pin="2"/>
<wire x1="34.29" y1="1.27" x2="30.48" y2="1.27" width="0.1524" layer="91"/>
<pinref part="R1" gate="G$1" pin="1"/>
<wire x1="30.48" y1="1.27" x2="10.16" y2="1.27" width="0.1524" layer="91"/>
<wire x1="30.48" y1="2.54" x2="30.48" y2="1.27" width="0.1524" layer="91"/>
<junction x="30.48" y="1.27"/>
</segment>
</net>
<net name="VCC" class="0">
<segment>
<pinref part="P+1" gate="VCC" pin="VCC"/>
<wire x1="27.94" y1="17.78" x2="27.94" y2="11.43" width="0.1524" layer="91"/>
<pinref part="USB-UART" gate="G$1" pin="P$5"/>
<wire x1="10.16" y1="11.43" x2="27.94" y2="11.43" width="0.1524" layer="91"/>
<label x="10.16" y="11.43" size="1.778" layer="95"/>
<pinref part="R1" gate="G$1" pin="2"/>
<wire x1="30.48" y1="10.16" x2="30.48" y2="11.43" width="0.1524" layer="91"/>
<wire x1="30.48" y1="11.43" x2="27.94" y2="11.43" width="0.1524" layer="91"/>
<junction x="27.94" y="11.43"/>
<pinref part="PYR0-PIEZO" gate="G$1" pin="P$1"/>
<wire x1="58.42" y1="11.43" x2="30.48" y2="11.43" width="0.1524" layer="91"/>
<junction x="30.48" y="11.43"/>
<label x="53.34" y="11.43" size="1.778" layer="95"/>
</segment>
</net>
<net name="RST" class="0">
<segment>
<pinref part="C1" gate="G$1" pin="1"/>
<pinref part="PYR0-PIEZO" gate="G$1" pin="P$5"/>
<wire x1="41.91" y1="1.27" x2="58.42" y2="1.27" width="0.1524" layer="91"/>
<label x="53.34" y="1.27" size="1.778" layer="95"/>
</segment>
</net>
</nets>
</sheet>
</sheets>
</schematic>
</drawing>
<compatibility>
<note version="8.2" severity="warning">
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
</note>
<note version="8.3" severity="warning">
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
</note>
<note version="8.3" severity="warning">
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.
</note>
</compatibility>
</eagle>
