DIODE >NAME 1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/530470210_sd.pdf>Datasheet </a> >NAME 1.25mm Pitch PicoBlade™ Header, Right Angle, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/530480210_sd.pdf>Datasheet </a> >NAME 1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/532610271_sd.pdf>Datasheet </a> >NAME 1 1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/533980271_sd.pdf>Datasheet </a> >NAME 1 * >Name >NAME >VALUE >NAME >VALUE >NAME MOUNTING PAD 2.8 mm, round MOUNTING PAD 3.0 mm, round 3,0 MOUNTING PAD 3.2 mm, round 3,2 MOUNTING PAD 3.3 mm, round MOUNTING PAD 3.6 mm, round MOUNTING PAD 4.1 mm, round MOUNTING PAD 4.3 mm, round MOUNTING PAD 4.5 mm, round MOUNTING PAD 5.0 mm, round MOUNTING PAD 5.5 mm, round Chip, 2.00 X 1.25 X 1.30 mm body Chip package with body size 2.00 X 1.25 X 1.30 mm >NAME >VALUE Ceramic Chip Capacitor KEMET 0603 reflow solder Metric Code Size 1608 >NAME >VALUE Chip, 1.60 X 0.90 X 0.80 mm body Chip package with body size 1.60 X 0.90 X 0.80 mm >NAME >VALUE Chip, 1.00 X 0.55 X 0.50 mm body Chip package with body size 1.00 X 0.55 X 0.50 mm >NAME >VALUE * >Name * >Name 1.25mm Pitch PicoBlade™ Header, Right Angle, 4 Circuits<a href =http://www.molex.com/pdm_docs/sd/530480410_sd.pdf>Datasheet </a> >NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME Solder jumper >NAME >VALUE Solder jumper >NAME >VALUE Solder jumper >NAME Dual In Line Package >NAME >VALUE Small Outline Package 14 >NAME >VALUE Small Shrink Outline Package >NAME >VALUE RTE (S-PQFP-N16) 3x3 mm Source: www.ti.com .. tpa6132a2 direct path stereo $.65.pdf >NAME >NAME >VALUE 1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 4 Circuits<a href =http://www.molex.com/pdm_docs/sd/530470410_sd.pdf>Datasheet </a> >NAME 1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 4 Circuits<a href =http://www.molex.com/pdm_docs/sd/532610471_sd.pdf>Datasheet </a> >NAME 1 1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 4 Circuits<a href =http://www.molex.com/pdm_docs/sd/533980471_sd.pdf>Datasheet </a> >NAME 1 * >Name >VALUE * >Name >VALUE * >Name >VALUE * >Name >VALUE * >Name >VALUE * >Name >VALUE TEST PAD >NAME >VALUE >TP_SIGNAL_NAME Spring loaded contact https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf Spring loaded contact https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf DIODE 1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/530470210_sd.pdf>Datasheet </a> 1.25mm Pitch PicoBlade™ Header, Right Angle, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/530480210_sd.pdf>Datasheet </a> 1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/532610271_sd.pdf>Datasheet </a> 1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/533980271_sd.pdf>Datasheet </a> MOUNTING PAD 2.8 mm, round MOUNTING PAD 3.3 mm, round MOUNTING PAD 3.6 mm, round MOUNTING PAD 4.1 mm, round MOUNTING PAD 4.5 mm, round MOUNTING PAD 5.0 mm, round MOUNTING PAD 5.5 mm, round Chip, 2.00 X 1.25 X 1.30 mm body Chip package with body size 2.00 X 1.25 X 1.30 mm Ceramic Chip Capacitor KEMET 0603 reflow solder Metric Code Size 1608 Chip, 1.60 X 0.90 X 0.80 mm body Chip package with body size 1.60 X 0.90 X 0.80 mm Chip, 1.00 X 0.55 X 0.50 mm body Chip package with body size 1.00 X 0.55 X 0.50 mm TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD 1.25mm Pitch PicoBlade™ Header, Right Angle, 4 Circuits<a href =http://www.molex.com/pdm_docs/sd/530480410_sd.pdf>Datasheet </a> MOUNTING PAD 3.0 mm, round MOUNTING PAD 3.2 mm, round TEST PAD Solder jumper Solder jumper Solder jumper Dual In Line Package Small Outline Package 14 Small Shrink Outline Package RTE (S-PQFP-N16) 3x3 mm Source: www.ti.com .. tpa6132a2 direct path stereo $.65.pdf MOUNTING PAD 4.3 mm, round 1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 4 Circuits<a href =http://www.molex.com/pdm_docs/sd/530470410_sd.pdf>Datasheet </a> 1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 4 Circuits<a href =http://www.molex.com/pdm_docs/sd/532610471_sd.pdf>Datasheet </a> 1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 4 Circuits<a href =http://www.molex.com/pdm_docs/sd/533980471_sd.pdf>Datasheet </a> TEST PAD TEST PAD Spring loaded contact https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf Spring loaded contact https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf >NAME >VALUE >NAME >VALUE >NAME 1 of 2 >Name >Value 2 of 2 >Name >Value >NAME >VALUE >NAME >VALUE GND IN OUT GND >NAME >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE V+ V- >NAME >VALUE DIODE low-leakage double diode CONNECTOR wire to board 1.25 mm (.049 inch) pitch header 301010000 5V Positive voltage regulator SMD SOT89 Package 304090045 MOUNTING PAD, round 302010178 CONNECTOR wire to board 1.25 mm (.049 inch) pitch header SUPPLY SYMBOL 302010005 Test pad SMD solder JUMPER Low power quad operational amplifier Source: <a href="http://www.st.com/internet/com/TECHNICAL_RESOURCES/TECHNICAL_LITERATURE/DATASHEET/CD00000533.pdf"> Data sgeet </a> 301010189 Supply Symbols GND, VCC, 0V, +5V, -5V, etc. Please keep in mind, that these devices are necessary for the automatic wiring of the supply signals. The pin name defined in the symbol is identical to the net which is to be wired automatically. In this library the device names are the same as the pin names of the symbols, therefore the correct signal names appear next to the supply symbols in the schematic. <author>Created by librarian@cadsoft.de</author> >VALUE SUPPLY SYMBOL Test Pins/Pads Cream on SMD OFF. new: Attribute TP_SIGNAL_NAME <author>Created by librarian@cadsoft.de</author> TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD >NAME >TP_SIGNAL_NAME Test pad Frames for Sheet and Layout >DRAWING_NAME >LAST_DATE_TIME >SHEET Sheet: FRAME DIN A3, landscape with location and doc. field ATMega88/168/328 Power LED's Holes Piezo Amp Circuit Test Points Connectors PT100 Amp Circuit Amplification Stage Amp Gain Adjustment Ladder Voltage Follower Comparator Since Version 8.2, EAGLE supports online libraries. The ids of those online libraries will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.