<B>DIODE</B>
>NAME
<b>1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530470210_sd.pdf>Datasheet </a>
>NAME
<b>1.25mm Pitch PicoBlade™ Header, Right Angle, 3 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530480310_sd.pdf>Datasheet </a>
>NAME
>VALUE
<b>1.25mm Pitch PicoBlade™ Header, Right Angle, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530480210_sd.pdf>Datasheet </a>
>NAME
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/532610271_sd.pdf>Datasheet </a>
>NAME
1
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/533980271_sd.pdf>Datasheet </a>
>NAME
1
>NAME
>VALUE
>NAME
>VALUE
>NAME
<b>MOUNTING PAD</b> 2.8 mm, round
<b>MOUNTING PAD</b> 3.0 mm, round
3,0
<b>MOUNTING PAD</b> 3.2 mm, round
3,2
<b>MOUNTING PAD</b> 3.3 mm, round
<b>MOUNTING PAD</b> 3.6 mm, round
<b>MOUNTING PAD</b> 4.1 mm, round
<b>MOUNTING PAD</b> 4.3 mm, round
<b>MOUNTING PAD</b> 4.5 mm, round
<b>MOUNTING PAD</b> 5.0 mm, round
<b>MOUNTING PAD</b> 5.5 mm, round
<b>Ceramic Chip Capacitor KEMET 0603 reflow solder</b><p>
Metric Code Size 1608
>NAME
>VALUE
Chip, 1.60 X 0.90 X 0.80 mm body
<p>Chip package with body size 1.60 X 0.90 X 0.80 mm</p>
>NAME
>VALUE
Chip, 1.00 X 0.55 X 0.50 mm body
<p>Chip package with body size 1.00 X 0.55 X 0.50 mm</p>
>NAME
>VALUE
<b>1.25mm Pitch PicoBlade™ Header, Right Angle, 6 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530480610_sd.pdf>Datasheet </a>
>NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>Solder jumper</b>
>NAME
>VALUE
<b>Solder jumper</b>
>NAME
>VALUE
<b>Solder jumper</b>
>NAME
<b>Dual In Line Package</b>
>NAME
>VALUE
<b>Small Shrink Outline Package</b>
>NAME
>VALUE
<b>RTE (S-PQFP-N16)</b> 3x3 mm<p>
Source: www.ti.com .. tpa6132a2 direct path stereo $.65.pdf
>NAME
>NAME
>VALUE
*
>Name
>VALUE
*
>Name
>VALUE
*
>Name
>VALUE
*
>Name
>VALUE
*
>Name
>VALUE
*
>Name
>VALUE
>NAME
>VALUE
Spring loaded contact
https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf
Spring loaded contact
https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf
<h3>0606 - LED SMT</h3>
<p>Specifications:
<ul><li>Pin count:4</li>
<li>Pin pitch: 0.8mm</li>
<li>Area:1.6mm L x 1.5mm W</li>
<li>Height: 0.55m</li>
</ul></p>
<p><b>Datasheet referenced for footprint:</b> <a href="http://optoelectronics.liteon.com/upload/download/DS22-2000-282/P_100_LTST-C195KGJRKT.pdf">LTST-C195KGJRKT</a></p>
<p>Example device(s):
<ul><li>LTST-C195KGJRKT</li>
</ul></p>
>NAME
>VALUE
>NAME
>VALUE
<b>1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 6 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530470610_sd.pdf>Datasheet </a>
>NAME
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 6 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/532610671_sd.pdf>Datasheet </a>
>NAME
1
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 6 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/533980671_sd.pdf>Datasheet </a>
>NAME
1
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 3 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530470310_sd.pdf>Datasheet </a>
>NAME
>VALUE
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 3 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/532610371_sd.pdf>Datasheet </a>
>NAME
>VALUE
1
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 3 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/533980371_sd.pdf>Datasheet </a>
>NAME
>VALUE
1
Chip, 2.00 X 1.25 X 1.30 mm body
<p>Chip package with body size 2.00 X 1.25 X 1.30 mm</p>
>NAME
>VALUE
<b>Small Outline Package 14</b>
>NAME
>VALUE
<B>DIODE</B>
<b>1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530470210_sd.pdf>Datasheet </a>
<b>1.25mm Pitch PicoBlade™ Header, Right Angle, 3 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530480310_sd.pdf>Datasheet </a>
<b>1.25mm Pitch PicoBlade™ Header, Right Angle, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530480210_sd.pdf>Datasheet </a>
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/532610271_sd.pdf>Datasheet </a>
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/533980271_sd.pdf>Datasheet </a>
<b>MOUNTING PAD</b> 2.8 mm, round
<b>MOUNTING PAD</b> 3.3 mm, round
<b>MOUNTING PAD</b> 3.6 mm, round
<b>MOUNTING PAD</b> 4.1 mm, round
<b>MOUNTING PAD</b> 4.5 mm, round
<b>MOUNTING PAD</b> 5.0 mm, round
<b>MOUNTING PAD</b> 5.5 mm, round
<b>Ceramic Chip Capacitor KEMET 0603 reflow solder</b><p>
Metric Code Size 1608
Chip, 1.60 X 0.90 X 0.80 mm body
<p>Chip package with body size 1.60 X 0.90 X 0.80 mm</p>
Chip, 1.00 X 0.55 X 0.50 mm body
<p>Chip package with body size 1.00 X 0.55 X 0.50 mm</p>
<b>TEST PAD</b>
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
<b>TEST PAD</b>
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
<b>1.25mm Pitch PicoBlade™ Header, Right Angle, 6 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530480610_sd.pdf>Datasheet </a>
<b>MOUNTING PAD</b> 3.0 mm, round
<b>MOUNTING PAD</b> 3.2 mm, round
TEST PAD
Solder jumper
Solder jumper
<b>Solder jumper</b>
Dual In Line Package
Small Shrink Outline Package
<b>RTE (S-PQFP-N16)</b> 3x3 mm<p>
Source: www.ti.com .. tpa6132a2 direct path stereo $.65.pdf
<b>MOUNTING PAD</b> 4.3 mm, round
Spring loaded contact
https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf
Spring loaded contact
https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf
<h3>0606 - LED SMT</h3>
<p>Specifications:
<ul><li>Pin count:4</li>
<li>Pin pitch: 0.8mm</li>
<li>Area:1.6mm L x 1.5mm W</li>
<li>Height: 0.55m</li>
</ul></p>
<p><b>Datasheet referenced for footprint:</b> <a href="http://optoelectronics.liteon.com/upload/download/DS22-2000-282/P_100_LTST-C195KGJRKT.pdf">LTST-C195KGJRKT</a></p>
<p>Example device(s):
<ul><li>LTST-C195KGJRKT</li>
</ul></p>
<b>1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 6 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530470610_sd.pdf>Datasheet </a>
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 6 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/532610671_sd.pdf>Datasheet </a>
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 6 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/533980671_sd.pdf>Datasheet </a>
<b>TEST PAD</b>
<b>TEST PAD</b>
<b>1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 3 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530470310_sd.pdf>Datasheet </a>
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 3 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/532610371_sd.pdf>Datasheet </a>
<b>1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 3 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/533980371_sd.pdf>Datasheet </a>
Chip, 2.00 X 1.25 X 1.30 mm body
<p>Chip package with body size 2.00 X 1.25 X 1.30 mm</p>
<b>Small Outline Package 14</b>
>NAME
>VALUE
>NAME
>VALUE
>NAME
>VALUE
>NAME
>NAME
>NAME
>VALUE
>NAME
>VALUE
GND
IN
OUT
GND
>NAME
>VALUE
>NAME
>NAME
>VALUE
>NAME
>VALUE
>NAME
>VALUE
>NAME
>NAME
>VALUE
>NAME
>VALUE
>NAME
>VALUE
V+
V-
>NAME
>VALUE
>NAME
>VALUE
>NAME
>VALUE
>NAME
>VALUE
<B>DIODE</B><p>
low-leakage double diode
<b>CONNECTOR</b><p>
wire to board 1.25 mm (.049 inch) pitch header
<b>CONNECTOR</b><p>
wire to board 1.25 mm (.049 inch) pitch header
301010000
5V Positive voltage regulator SMD SOT89 Package
304090045
<b>MOUNTING PAD</b>, round
302010178
<b>CONNECTOR</b><p>
wire to board 1.25 mm (.049 inch) pitch header
<b>SUPPLY SYMBOL</b>
302010005
<b>Test pad</b>
SMD solder <b>JUMPER</b>
<b>Low power quad operational amplifier</b><p>
Source: <a href="http://www.st.com/internet/com/TECHNICAL_RESOURCES/TECHNICAL_LITERATURE/DATASHEET/CD00000533.pdf"> Data sgeet </a>
301010189
AVR 32KBytes Flash, 1KBytes EEPROM, 2KBytes RAM, w - 20MHZ, QFN/MFL, IND TEMP, GREEN 5 V/ DFN/QFN (M)
<h3>Everlight Electronics Co Ltd EAST1616RGBB4 0606 RGB LED</h3>
<p><li><b>Color:</b> RGB</li>
<li><b>Lens Transparency: </b> Clear</li>
<li><b>Lens Style/Size:</b> Rectangle with Flat top, 1.10 x 1.5 mm</li>
<li><b>mC Rating</b>45mcd Red, 35 mcd Green</li>
<li><b>Current:</b> 5mA Red, 5mA Green, 5mA</li>
<li><b>Forward Voltage: </b> 2V Red, 2V Green</li>
<li><b>Packages:</b> 0606</li>
</p>
<p>SparkFun Products:
<ul><li><a href=”[https://www.sparkfun.com/products/12958]”>Electric Imp imp002 Breakout</a></li>
</ul></p>
<b>Supply Symbols</b><p>
GND, VCC, 0V, +5V, -5V, etc.<p>
Please keep in mind, that these devices are necessary for the
automatic wiring of the supply signals.<p>
The pin name defined in the symbol is identical to the net which is to be wired automatically.<p>
In this library the device names are the same as the pin names of the symbols, therefore the correct signal names appear next to the supply symbols in the schematic.<p>
<author>Created by librarian@cadsoft.de</author>
>VALUE
<b>SUPPLY SYMBOL</b>
<b>Test Pins/Pads</b><p>
Cream on SMD OFF.<br>
new: Attribute TP_SIGNAL_NAME<br>
<author>Created by librarian@cadsoft.de</author>
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
TEST PAD
>NAME
>TP_SIGNAL_NAME
<b>Test pad</b>
<b>Frames for Sheet and Layout</b>
>DRAWING_NAME
>LAST_DATE_TIME
>SHEET
Sheet:
<b>FRAME</b><p>
DIN A3, landscape with location and doc. field
ATMega88/168/328
Power
LED's
Holes
Piezo Amp Circuit
Test Points
Connectors
PT100 Amp Circuit
Amplification Stage
Amp Gain Adjustment Ladder
Voltage Follower
Comparator
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.