+ -
+ -
+ -
- +
+ -
Fan0
Fan1
PZ1
HE0
2B 2A 1A 1B
<B>DIODE</B>
>NAME
>Name
<b>1.25mm Pitch PicoBlade™ Header, Right Angle, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530480210_sd.pdf>Datasheet </a>
>NAME
>NAME
>VALUE
*
>Name
>NAME
>VALUE
<b>3 mm SMD Trimming Potentiometer</b> Side Adjust<p>
Source: http://www.bourns.com/data/global/PDFs/3223.PDF
>NAME
<b>2.54mm Pitch SL™ Header, Low Profile, Single Row, Right Angle, 3.05mm Pocket, Shrouded, 5 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating</b><p><a href =http://www.molex.com/pdm_docs/sd/705530004_sd.pdf>Datasheet </a>
>NAME
>VALUE
Double-row, 4-pin Receptacle Header (Female) Right Angle, 2.54 mm (0.10 in) pitch, 7.36 mm insulator length, 5.56 X 7.36 X 5.56 mm body
<p>Double-row (2X2), 4-pin Receptacle Header (Female) Right Angle package with 2.54 mm (0.10 in) pitch, 0.64 mm lead width, 3.00 mm tail length and 7.36 mm insulator length with body size 5.56 X 7.36 X 5.56 mm, pin pattern - counter-clockwise from bottom left</p>
>NAME
>VALUE
>NAME
<b>MOUNTING PAD</b> 2.8 mm, round
Chip, 1.60 X 0.90 X 0.80 mm body
<p>Chip package with body size 1.60 X 0.90 X 0.80 mm</p>
>NAME
>VALUE
<b>SC70-3 Reflow soldering</b><p>
Philips SC01_Mounting_1996.pdf<p>
ROHM : UMT3 ; EIAJ : SC-70
>NAME
>NAME
>VALUE
<B>DIODE</B>
<b>1.25mm Pitch PicoBlade™ Header, Right Angle, 2 Circuits</b><p><a href =http://www.molex.com/pdm_docs/sd/530480210_sd.pdf>Datasheet </a>
<b>3 mm SMD Trimming Potentiometer</b> Side Adjust<p>
Source: http://www.bourns.com/data/global/PDFs/3223.PDF
<b>2.54mm Pitch SL™ Header, Low Profile, Single Row, Right Angle, 3.05mm Pocket, Shrouded, 5 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating</b><p><a href =http://www.molex.com/pdm_docs/sd/705530004_sd.pdf>Datasheet </a>
Double-row, 4-pin Receptacle Header (Female) Right Angle, 2.54 mm (0.10 in) pitch, 7.36 mm insulator length, 5.56 X 7.36 X 5.56 mm body
<p>Double-row (2X2), 4-pin Receptacle Header (Female) Right Angle package with 2.54 mm (0.10 in) pitch, 0.64 mm lead width, 3.00 mm tail length and 7.36 mm insulator length with body size 5.56 X 7.36 X 5.56 mm, pin pattern - counter-clockwise from bottom left</p>
<b>MOUNTING PAD</b> 2.8 mm, round
Chip, 1.60 X 0.90 X 0.80 mm body
<p>Chip package with body size 1.60 X 0.90 X 0.80 mm</p>
<b>SC70-3 Reflow soldering</b><p>
Philips SC01_Mounting_1996.pdf<p>
ROHM : UMT3 ; EIAJ : SC-70
<b>Test Pins/Pads</b><p>
Cream on SMD OFF.<br>
new: Attribute TP_SIGNAL_NAME<br>
<author>Created by librarian@cadsoft.de</author>
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
TEST PAD
TEST PAD
<b>EAGLE Design Rules</b>
<p>
Die Standard-Design-Rules sind so gewählt, dass sie für
die meisten Anwendungen passen. Sollte ihre Platine
besondere Anforderungen haben, treffen Sie die erforderlichen
Einstellungen hier und speichern die Design Rules unter
einem neuen Namen ab.
<b>EAGLE Design Rules</b>
<p>
The default Design Rules have been set to cover
a wide range of applications. Your particular design
may have different requirements, so please make the
necessary adjustments and save your customized
design rules under a new name.
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
Since Version 8.3, EAGLE supports Fusion synchronisation.
This feature will not be available in this version and saving
the document will break the link to the Fusion PCB feature.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.