DIODE >NAME 1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/530470210_sd.pdf>Datasheet </a> >NAME 1.25mm Pitch PicoBlade™ Header, Right Angle, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/530480210_sd.pdf>Datasheet </a> >NAME 1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/532610271_sd.pdf>Datasheet </a> >NAME 1 1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/533980271_sd.pdf>Datasheet </a> >NAME 1 * >Name >NAME >VALUE >Name 2.54mm Pitch SL™ Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 5 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating<a href =http://www.molex.com/pdm_docs/sd/705430004_sd.pdf>Datasheet </a> >NAME >VALUE 1 2.54mm Pitch SL™ Header, Low Profile, Single Row, Right Angle, 3.05mm Pocket, Shrouded, 5 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating<a href =http://www.molex.com/pdm_docs/sd/705530004_sd.pdf>Datasheet </a> >NAME >VALUE SL™ Wire-to-Board Header, Surface Mount, Single Row, Vertical, 3.05mm Pocket, Shrouded, 4 Circuits, Tin (Sn) Plating<a href =http://www.molex.com/pdm_docs/sd/705530004_sd.pdf>Datasheet </a> >NAME >VALUE 1 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits, Tin (Sn) Plating<a href =http://www.molex.com/pdm_docs/sd/015913044_sd.pdf>Datasheet </a> >NAME >VALUE Double-row, 4-pin Receptacle Header (Female) Right Angle, 2.54 mm (0.10 in) pitch, 7.36 mm insulator length, 5.56 X 7.36 X 5.56 mm body Double-row (2X2), 4-pin Receptacle Header (Female) Right Angle package with 2.54 mm (0.10 in) pitch, 0.64 mm lead width, 3.00 mm tail length and 7.36 mm insulator length with body size 5.56 X 7.36 X 5.56 mm, pin pattern - counter-clockwise from bottom left >NAME >VALUE >NAME MOUNTING PAD 2.8 mm, round MOUNTING PAD 3.0 mm, round 3,0 MOUNTING PAD 3.2 mm, round 3,2 MOUNTING PAD 3.3 mm, round MOUNTING PAD 3.6 mm, round MOUNTING PAD 4.1 mm, round MOUNTING PAD 4.3 mm, round MOUNTING PAD 4.5 mm, round MOUNTING PAD 5.0 mm, round MOUNTING PAD 5.5 mm, round Chip, 2.00 X 1.25 X 1.30 mm body Chip package with body size 2.00 X 1.25 X 1.30 mm >NAME >VALUE Ceramic Chip Capacitor KEMET 0603 reflow solder Metric Code Size 1608 >NAME >VALUE Chip, 1.60 X 0.90 X 0.80 mm body Chip package with body size 1.60 X 0.90 X 0.80 mm >NAME >VALUE Chip, 1.00 X 0.55 X 0.50 mm body Chip package with body size 1.00 X 0.55 X 0.50 mm >NAME >VALUE * >Name * >Name >NAME >VALUE TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME Dual In Line Package >NAME >VALUE Small Outline Package 14 >NAME >VALUE Small Shrink Outline Package >NAME >VALUE RTE (S-PQFP-N16) 3x3 mm Source: www.ti.com .. tpa6132a2 direct path stereo $.65.pdf >NAME Spring loaded contact https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf Spring loaded contact https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf DIODE 1.25mm Pitch PicoBlade™ Wire-to-Board Header, Vertical, with Friction Lock, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/530470210_sd.pdf>Datasheet </a> 1.25mm Pitch PicoBlade™ Header, Right Angle, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/530480210_sd.pdf>Datasheet </a> 1.25mm Pitch PicoBlade™ Header, Surface Mount, Right Angle, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/532610271_sd.pdf>Datasheet </a> 1.25mm Pitch PicoBlade™ Header, Surface Mount, Vertical, 2 Circuits<a href =http://www.molex.com/pdm_docs/sd/533980271_sd.pdf>Datasheet </a> 2.54mm Pitch SL™ Header, Low Profile, Single Row, Right Angle, 3.05mm Pocket, Shrouded, 5 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating<a href =http://www.molex.com/pdm_docs/sd/705530004_sd.pdf>Datasheet </a> 2.54mm Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 4 Circuits, Tin (Sn) Plating<a href =http://www.molex.com/pdm_docs/sd/015913044_sd.pdf>Datasheet </a> Double-row, 4-pin Receptacle Header (Female) Right Angle, 2.54 mm (0.10 in) pitch, 7.36 mm insulator length, 5.56 X 7.36 X 5.56 mm body Double-row (2X2), 4-pin Receptacle Header (Female) Right Angle package with 2.54 mm (0.10 in) pitch, 0.64 mm lead width, 3.00 mm tail length and 7.36 mm insulator length with body size 5.56 X 7.36 X 5.56 mm, pin pattern - counter-clockwise from bottom left MOUNTING PAD 2.8 mm, round MOUNTING PAD 3.3 mm, round MOUNTING PAD 3.6 mm, round MOUNTING PAD 4.1 mm, round MOUNTING PAD 4.5 mm, round MOUNTING PAD 5.0 mm, round MOUNTING PAD 5.5 mm, round Chip, 2.00 X 1.25 X 1.30 mm body Chip package with body size 2.00 X 1.25 X 1.30 mm Ceramic Chip Capacitor KEMET 0603 reflow solder Metric Code Size 1608 Chip, 1.60 X 0.90 X 0.80 mm body Chip package with body size 1.60 X 0.90 X 0.80 mm Chip, 1.00 X 0.55 X 0.50 mm body Chip package with body size 1.00 X 0.55 X 0.50 mm TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD Dual In Line Package Small Outline Package 14 Small Shrink Outline Package RTE (S-PQFP-N16) 3x3 mm Source: www.ti.com .. tpa6132a2 direct path stereo $.65.pdf 2.54mm Pitch SL™ Header, Single Row, Vertical, 3.05mm Pocket, Shrouded, 5 Circuits, 0.38µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating<a href =http://www.molex.com/pdm_docs/sd/705430004_sd.pdf>Datasheet </a> SL™ Wire-to-Board Header, Surface Mount, Single Row, Vertical, 3.05mm Pocket, Shrouded, 4 Circuits, Tin (Sn) Plating<a href =http://www.molex.com/pdm_docs/sd/705530004_sd.pdf>Datasheet </a> MOUNTING PAD 3.0 mm, round MOUNTING PAD 3.2 mm, round MOUNTING PAD 4.3 mm, round TEST PAD TEST PAD Spring loaded contact https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf Spring loaded contact https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104320.pdf >NAME >VALUE >NAME >VALUE >NAME 1 of 2 >Name >Value 2 of 2 >Name >Value >NAME >VALUE >Name >NAME >VALUE >NAME >NAME >VALUE >NAME >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >NAME >VALUE V+ V- DIODE low-leakage double diode CONNECTOR wire to board 1.25 mm (.049 inch) pitch header 301010000 CONNECTOR wire to board 2.54 mm (0.100") pitch header 304090045 MOUNTING PAD, round 302010005 302010178 301010189 Test pad Low power quad operational amplifier Source: <a href="http://www.st.com/internet/com/TECHNICAL_RESOURCES/TECHNICAL_LITERATURE/DATASHEET/CD00000533.pdf"> Data sgeet </a> Supply Symbols GND, VCC, 0V, +5V, -5V, etc. Please keep in mind, that these devices are necessary for the automatic wiring of the supply signals. The pin name defined in the symbol is identical to the net which is to be wired automatically. In this library the device names are the same as the pin names of the symbols, therefore the correct signal names appear next to the supply symbols in the schematic. <author>Created by librarian@cadsoft.de</author> >VALUE SUPPLY SYMBOL Supply Symbols GND, VCC, 0V, +5V, -5V, etc. Please keep in mind, that these devices are necessary for the automatic wiring of the supply signals. The pin name defined in the symbol is identical to the net which is to be wired automatically. In this library the device names are the same as the pin names of the symbols, therefore the correct signal names appear next to the supply symbols in the schematic. <author>Created by librarian@cadsoft.de</author> >VALUE >VALUE SUPPLY SYMBOL SUPPLY SYMBOL Test Pins/Pads Cream on SMD OFF. new: Attribute TP_SIGNAL_NAME <author>Created by librarian@cadsoft.de</author> TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD >NAME >VALUE >TP_SIGNAL_NAME TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD TEST PAD >NAME >TP_SIGNAL_NAME Test pad Frames for Sheet and Layout >DRAWING_NAME >LAST_DATE_TIME >SHEET Sheet: FRAME DIN A3, landscape with location and doc. field ATMega48 Power LED's Holes Piezo Amp Circuit Test Points Connectors VRef Buffer Auto Adjust Ladder Comparator Piezo In Amplifier - 3X Gain 2.50V +/- 20mV - + Since Version 8.2, EAGLE supports online libraries. The ids of those online libraries will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports URNs for individual library assets (packages, symbols, and devices). The URNs of those assets will not be understood (or retained) with this version. Since Version 8.3, EAGLE supports the association of 3D packages with devices in libraries, schematics, and board files. Those 3D packages will not be understood (or retained) with this version.